| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a technique in which the heat of an electronic part mounted on a laminated printed board is dissipated efficiently and easily. <P>SOLUTION: In the heat-dissipation structure of the laminated printed board, a heat-generating part is installed in the laminated board. Consequently, heat can be dissipated efficiently and effectively from the whole periphery of the heat-generating part. <P>COPYRIGHT: (C)2004,JPO&NCIPI |
