发明名称 THERMALLY FUSIBLE POLYIMIDE FILMS, LAMINATED SHEET USING POLYIMIDE FILM AND METHOD FOR MANUFACTURING POLYIMIDE FILM/LAMINATED SHEET
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a thermally fusible polyimide film with high heat resistance which is used for manufacturing a one side metallic foil laminated sheet, especially a one side copper-plated laminated sheet, both not using a release paper during laminating a metallic foil, and a one side metallic foil laminated sheet, especially a one side copper-plated laminated sheet, both using the polyimide film. <P>SOLUTION: This polyimide film has a thermally fusible polyimide layer with a thickness of 4 to 45μm formed on both surfaces of a heat-resistant polyimide layer (an S1 layer) with almost the same thickness as the former and a total thickness of 3 to 10μm of the thickness of the thermally fusible polyimide layer formed on one surface of the heat-resistant polyimide layer (the S1 layer) and the thickness of the thermally fusible polyimide layer formed on the other surface. In addition, the 0.1 to 2μm thick heat-resistant polyimide layer (an S2 layer) without heat fusibility is laminated on the thermally-fusible polyimide layer one surface of the heat-resistant polyimide layer (the S1 layer), so that the polyimide film has heat fusibility only on one surface. Thus the polyimide film having the heat fusibility on one surface and a copper foil are laminated over each other by thermal contact bonding through the polyimide layer with the heat fusibility. <P>COPYRIGHT: (C)2004,JPO&NCIPI</p>
申请公布号 JP2004230670(A) 申请公布日期 2004.08.19
申请号 JP20030020942 申请日期 2003.01.29
申请人 UBE IND LTD 发明人 ABU TOSHIHIKO;IWAI HIDEKI;SHIMOKAWA HIROTO;NISHINO TOSHIYUKI
分类号 B32B27/34;B32B15/08;B32B15/088;B32B37/20;H05K1/03;H05K3/00;(IPC1-7):B32B27/34;B32B31/08 主分类号 B32B27/34
代理机构 代理人
主权项
地址