| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a material machining method by a laser whereby the stable and accurate adjustments of circuit functions and circuit constants are made possible as trimming results, without damaging the base materials present under trimmed objects, in a resistor, etc. provided on a board made of a ceramic or an organic material. <P>SOLUTION: This material machining method by an ultra-short pulse laser is characterised in that an ultra-short pulse laser having the oscillation pulse width not larger than 1 picosecond is used in electronic circuit components and in the wiring circuits of an electronic-circuit board, in order to adjust the circuit functions and circuit constants of mounted components, and by irradiating a resistor with the ultra-short pulse laser having a constant laser irradiating energy, a groove is so formed in a fixed depth from the surface of the irradiated object as to adjust the resistance value, capacitance, inductance, and the like of the irradiated object. <P>COPYRIGHT: (C)2004,JPO&NCIPI</p> |
