| 摘要 |
PROBLEM TO BE SOLVED: To provide a wet processing apparatus which is capable of reducing foot prints and a dead space, carrying out wet processing uniformly, and protecting a wafer against damage caused by wrong chucking. SOLUTION: The wet processing apparatus 1 is equipped with a chemical processing tank 4 containing chemicals 3 for wet-processing wafers 2, a wafer holder 5 holding the wafers 2 collectively in a vertical direction, holder chucks 6a and 6b chucking the upper part 5a of the wafer holder 5, and a transfer mechanism 7 transferring the wafer holder 5 through the intermediary of the holder chucks 6a and 6b. Furthermore, the wet processing apparatus 1 is equipped with a holder placing pad 11 where the wafer holder 5 loaded with the wafers 2 is mounted, and a rotating mechanism 12 rotating the holder placing pad 11. COPYRIGHT: (C)2004,JPO&NCIPI |
