发明名称 METHOD AND SYSTEM FOR SEPARATING CHIP COMPONENTS
摘要 PROBLEM TO BE SOLVED: To separate a green sheet cut into chip shape in safety without causing any damage on individual chip components while sustaining the separation rate, and to automate the operation and to save the labor. SOLUTION: The green sheet 80 cut into chip shape is stuck to an adhesive sheet 1 which is then carried to a separating edge section 50 where the green sheet 80 is separated into individual chip components by running the adhesive sheet 1 on a curved surface, and then the chip components are stripped from the adhesive sheet 1 by lowering adhesion thereof at a stripping section 60. Separation of the chip components is accelerated by pressing the green sheet 80 partially and sequentially by means of a roller at a separation accelerating section 40 on this side of the separating edge section 50 thereby applying a shearing force to the cutting part. COPYRIGHT: (C)2004,JPO&NCIPI
申请公布号 JP2004235436(A) 申请公布日期 2004.08.19
申请号 JP20030022124 申请日期 2003.01.30
申请人 TDK CORP 发明人 SUKAI MASANORI;SUDA HIROMI;SUZUKI KEI;HIROOKA RIICHI
分类号 H01G4/30;H01G13/00;(IPC1-7):H01G4/30 主分类号 H01G4/30
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