| 摘要 |
PROBLEM TO BE SOLVED: To provide a circuit board and a manufacturing method of the same capable of shortening a forming time of a circuit pattern, increasing the junction strength between a circuit pattern surface and a plated layer, and improving good solder wettability of the circuit pattern surface. SOLUTION: This manufacturing method of a circuit board comprises a step of forming a circuit layer for forming a circuit layer 3b at least on the surface side of an insulating substrate 2, and a step of forming a circuit pattern for selectively eliminating the circuit layer 3b to form a circuit pattern 3a. After the step of forming the circuit layer and before the step of forming the circuit pattern, the surface of the circuit layer 3a is roughened in advance. COPYRIGHT: (C)2004,JPO&NCIPI
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