发明名称 |
Method of manufacturing a semiconductor component |
摘要 |
A method of manufacturing a semiconductor component includes forming a first electrically insulating layer (120) and a second electrically insulating layer (130) over a semiconductor substrate (110). The method further includes etching a first trench (140) and a second trench (150) through the first and second electrically insulating layers and into the semiconductor substrate, and etching a third trench (610) through a bottom surface of the second trench and into the semiconductor substrate. The third trench has a first portion (920) and a second portion (930) interior to the first portion. The method still further includes forming a third electrically insulating layer (910) filling the first trench and the first portion of the third trench without filling the second portion of the third trench, and also includes forming a plug layer (1010) in the second portion of the third trench.
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申请公布号 |
US2004161931(A1) |
申请公布日期 |
2004.08.19 |
申请号 |
US20030369874 |
申请日期 |
2003.02.18 |
申请人 |
MOTOROLA, INC. |
发明人 |
PARTHASARATHY VIJAY;KHEMKA VISHNU;ZHU RONGHUA;BOSE AMITAVA;ROGGENBAUER TODD;HUI PAUL;BUTNER MICHAEL C. |
分类号 |
H01L21/308;H01L21/762;(IPC1-7):H01L21/302;H01L21/311;H01L21/461 |
主分类号 |
H01L21/308 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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