STRUCTURE OF MOUNTING ELECTRONIC COMPONENTS AND FABRICATING METHOD THEREOF TO EASILY ELIMINATE STEP CAUSED BY THICKNESS OF ELECTRONIC COMPONENTS

摘要

PURPOSE: A structure of mounting electronic components is provided to easily eliminate a step caused by the thickness of the electronic components by forming an insulation layer surrounding the electronic components. CONSTITUTION: An interconnection substrate(2) has an interconnection pattern(32,32a). The first insulation layer is formed on the interconnection substrate, including an opening(38a) in a region on which the electronic components are mounted. A connection terminal of the electronic components is flip-chip mounted on the interconnection pattern exposed to the opening of the first insulation layer. The electronic components are coated with the second insulation layer. A via hole(34x,36x) is formed in a predetermined portion of the first and second insulation layers above the interconnection pattern. An upper interconnection pattern is formed on the second insulation layer, connected to the interconnection pattern through the via hole.