发明名称 SOLDER PASTE PRINTING MACHINE
摘要 <P>PROBLEM TO BE SOLVED: To provide a solder paste printing machine and a board conveyance program which vary a conveyance time according to the size of a board to be conveyed and perform conveyance of the board efficiently. <P>SOLUTION: In the solder paste printing machine 10, a mask M whereon a printing pattern is formed and a board K which is an object of printing of solder paste are positioned relatively and the board K is laid under the mask M together, while the solder paste is applied on the top of the mask M and printed. The machine is equipped with an image pickup means 40 for relative position alignment of the mask M with the board K and a cleaning means 60 which is conveyed along the lower side of the mask M and cleans it. The image pickup means 40 is disposed outside the area of conveyance of the cleaning means 60. <P>COPYRIGHT: (C)2004,JPO&NCIPI
申请公布号 JP2004230782(A) 申请公布日期 2004.08.19
申请号 JP20030023699 申请日期 2003.01.31
申请人 JUKI CORP 发明人 ISHIKAWA ATSUSHI
分类号 B41F15/26;B41F15/08;B41F15/12;B41F33/14;B41F35/00;H05K3/34 主分类号 B41F15/26
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