| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing apparatus for a semiconductor device that can control semiconductor device's characteristics degradation, failure, and decrease in flexural strength. SOLUTION: On the reverse surface side 21B of a semiconductor wafer 21's device formation surface 21A, damage layers 24-1, 24-2, 24-3, and so on are formed that will become a starting point for dividing into individual semiconductors using a damage forming means. These damage layers are used as a starting point to partition the semiconductor wafer into individual semiconductor devices by a partitioning means. Then, the reverse side of this semiconductor wafer is removed by a removing means, up to a depth where there is at least no damage layer. After the wafer is divided, using the damage layer as a starting point that is formed in a region to be thrown away, since the reverse side is removed by a reverse side grinder, there remains no cutting streak on the side of a formed semiconductor device, and this results in minimal damage. COPYRIGHT: (C)2004,JPO&NCIPI |
