| 摘要 |
PROBLEM TO BE SOLVED: To provide a low dielectric and heat-resistant styrenic resin composition having low dielectric characteristics and high heat resistance capable of being used in the high-frequency band. SOLUTION: The low dielectric and heat-resistant resin composition is obtained by adding 1-10 pts.wt. inorganic filler such as clay which is surface-treated with an alkoxysilane having one or more phenyl or styryl substituents in the molecule such as phenyltriethoxysilane and p-styryltrimethoxysilane to 100 pts.wt. syndiotactic polystyrene resin and by this resin composition, excellent characteristics with any of dielectric characteristics, soldering heat resistance, and processability can be obtained. COPYRIGHT: (C)2004,JPO&NCIPI |
