| 摘要 |
PROBLEM TO BE SOLVED: To provide an assembly failure analytical device capable of analyzing a wiring failure accurately in a short time by utilizing a standard function of a tester without breaking a package. SOLUTION: This device has a tester 3 equipped with an input driver 11 for supplying a test program, comparators 16, 17 for comparing an inspection value with a reference value, and a changeover switch 12 for switching them, and has a semiconductor inspection jig 2 equipped with a socket 7 equipped with a connection pin 8 for connecting to a test semiconductor device 1 and a test board 6 equipped with electric wire length correction function between the tester and the test side. An approximate test and a detailed test are performed continuously by the test program from the tester 3. COPYRIGHT: (C)2004,JPO&NCIPI
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