| 摘要 |
PROBLEM TO BE SOLVED: To permit the manufacturing of a wiring substrate, thin and provided with a wiring pattern formed so as to have a high density. SOLUTION: A first metal layer 41 is bonded onto the surface of a core substrate 10 through a bonding layer 40a, then, a second metal layer 42 is adsorbed by vacuum to the first metal layer 41 to form a laminate 50, in which a wiring pattern 44 is electrically connected between the layers through an insulating layer 46 by a build-up method. Thereafter, vacuum between the first metal layer 41 and the second metal layer 42 is broken whereby the second metal layer 42 is separated from the first metal layer 41 together with the laminate 50 to form the wiring substrate by applying necessary treatments on the laminate 50. COPYRIGHT: (C)2004,JPO&NCIPI |
