| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a resin sealing metallic mold for discharging air in a cavity and manufacture of a semiconductor device using the metallic mold by solving the problem that, in the conventional resin sealing metallic mold, especially in the case of resin molding of a QFN type package, a metal thin wire is bent in an end to which the air in the cavity is driven away, in a method for manufacturing a semiconductor device of a small-sized package having a packaging node on a rear face of a resin sealing body. <P>SOLUTION: In the resin sealing metal mold 21, a deflation groove 32 is arranged in the end of a cavity 30 to which air in the cavity 30 is driven away and in a lower metal mold 23 in the vicinity of the end. The air driven away to the cavity 30 end between an adhesive sheet 29 and the lower metal mold 23 is ejected through the deflation groove 32 outside. The pattering of the lead frame 27 and the adhesive sheet 29 in the cavity 30 end can be restrained. As the result, bending or the like of a metal thread 35 or the like of a mounting part positioned in the cavity 30 end can be prevented. <P>COPYRIGHT: (C)2004,JPO&NCIPI</p> |
