| 摘要 |
PROBLEM TO BE SOLVED: To obtain a proper solder solidified status by efficiently cooling melting solder after reflow treatment. SOLUTION: A cooling part 140 for cooling the solder of a wiring board treated by a reflow part 120 is provided with cooling devices 140A and 140B in two stages of gentle and quick operations. The first cooling device 140A is configured to gently cool the wiring board 200 by using a cooling fan 142 and an exhaust duct 144 so that at least the surface of melting solder can be solidified. Then, the second cooling device 140B is configured to supply strong cooling air to the solder application face of the wiring board 200 by nozzle spray from an air nozzle 150 so that the inside of semi-melting solder can be quickly cooled. Thus, it is possible to quickly cool the inside of the solder without damaging the surface shape of the solder, to obtain the satisfactory solidified status of the inside of the solder, and to perform the cooling operation in a short time. COPYRIGHT: (C)2004,JPO&NCIPI
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