Conductive ink compositions which can be cured to highly conductive metal traces by means of "chemical welding" include adhesion promoting additives for providing improved adhesion of the compositions to various substrates.
申请公布号
WO2004069941(A2)
申请公布日期
2004.08.19
申请号
WO2004US02294
申请日期
2004.01.27
申请人
PARELEC INC.
发明人
CONAGHAN, BRIAN, F.;JABLONSKI, GREGORY, A.;KYDD, PAUL, H.;MENDOZA, ISABEL;RICHARD, DAVID, L.
