| 摘要 |
PURPOSE: To provide an electrodeposited copper foil having a high enough peel strength to meet the demands for recent printed circuit boards and an excellent high frequency transmission characteristic and a method of production of the same. CONSTITUTION: The electrodeposited copper foil is characterized in that a part of its surface comprises a rough surface having knob-like projections and a surface roughness of 2 to 4μm, wherein the rough surface having the knob-like projections and the surface roughness of 2 to 4μm is a surface of an untreated copper foil for bonding with a resin substrate and is further roughening treated by running a predetermined current through the foil for a predetermined time in an electroforming bath, wherein the electroforming bath is an acidic electroforming bath containing at least one of molybdenum, cobalt, nickel, iron, tungsten and arsenic, wherein the rough surface is further formed with a copper plating layer, wherein the rough surface is further formed with a copper plating layer and at least one layer of nickel plating, zinc plating, cobalt plating, plating of an alloy of the same and a chromate treatment layer on that, and according to need further formed with a coupling agent treatment layer, and wherein the rough surface having the knob-like projections and the surface roughness of 2 to 4μm is a surface of an untreated copper foil for bonding with a resin substrate and is further formed with a copper plating layer and at least one layer of nickel plating, zinc plating, cobalt plating, plating of an alloy of the same and a chromate treatment layer on that, and according to need further formed with a coupling agent treatment layer. |
