| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method for sealing and molding an electronic component with a resin capable of efficiently solve the problems on resin molding such as resin burrs on a face 10 where a chip is not mounted, inferiority of a wire and excessive use of the resin by closely sticking the face where the chip is not mounted for a lead frame mounted with a semiconductor chip being the electronic component and a release film without any gap and surely, and an apparatus therefor. <P>SOLUTION: In the method for sealing and molding the electronic component with the resin, when upper and lower molds 1 and 2 are clamped, a sliding member 21 is moved upward from a part approximately just below a plurality of the chips 8 and the wires 9 inserted and mounted in a cavity forming part 5, and a required amount of a molten resin 13 on the top face of the sliding member 21 is also elevated therewith to immerse and wrap a plurality of the number of the chips 8 and the wires 9 and it is compression-molded by a required pressure to closely stick without gap and surely the face 10 where the chip is not mounted of the lead frame 7 mounted with the chips 8 being the electronic components and the release film 4. <P>COPYRIGHT: (C)2004,JPO&NCIPI</p> |
