| 摘要 |
PROBLEM TO BE SOLVED: To provide an inexpensive electronic component container formed of resin, having a hermetically sealed structure for housing piezoelectric components and electronic components such as piezoelectric oscillator, piezoelectric resonator, elastic surface wave element, sensor element, and surface acoustic wave element; and to realize a container structure improved in adhesion efficiency at a sealing part. SOLUTION: The problem of the electronic component container constituting a hermetically sealed structure by jointing a container components and a lid component formed of a resin material, is solved by roughening the surface of the jointing part of the container component and the lid component. COPYRIGHT: (C)2004,JPO&NCIPI
|
