发明名称 THERMOSETTING WATER-SOLUBLE ACRYLIC RESIN COMPOSITION, ADHESIVE COMPOSITION, AND DECORATIVE LAMINATE
摘要 PROBLEM TO BE SOLVED: To obtain a resin composition which emits no formaldehyde, to obtain an adhesive composition, and to obtain a decorative laminate. SOLUTION: A composition (A) prepared by polymerizing 100 pts. wt. (meth)acrylic acid monomer with at most 100 pts. wt. radically polymerizable monomer is formulated with 1 to 300 pts. wt., per 100 pts. wt. composition (A), compound (B) having any one of chemical bonds represented by formulae 1 to 4 and having at least two amide groups in the molecule or having at least two hydroxyl groups in the molecule. Desirably, the radically polymerizable monomer comprises a (meth)acrylic ester monomer and/or an unsaturated carboxylic acid. Further, 100 pts. wt. composition (A) is formulated with 1 to 300 pts. wt. compound (C) having a chemical bond represented by formula 5. COPYRIGHT: (C)2004,JPO&NCIPI
申请公布号 JP2004231761(A) 申请公布日期 2004.08.19
申请号 JP20030021232 申请日期 2003.01.30
申请人 AICA KOGYO CO LTD 发明人 EBIHARA KENJI;ITO KISHUN;KAEDE KAZUKI
分类号 B32B27/30;B32B33/00;C08K5/20;C08K5/29;C08L33/02;C08L71/02;C09J11/06;C09J133/02;C09J175/04;(IPC1-7):C08L33/02 主分类号 B32B27/30
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