| 摘要 |
PROBLEM TO BE SOLVED: To solve problems that the temperature of measurement is dispersed, and the responsive speed of the temperature measurement is reduced if the heat capacity is increased to improve the soaking in a fitting structure in which only a temperature measurement element used to adjust the temperature of a soaking plate in a wafer heating device is inserted. SOLUTION: In the wafer heating device, one main surface of a soaking plate formed of ceramic is a wafer loading side, a heating resistor is provided on the other main surface or inside the wafer heating device, and a power supply unit to be electrically connected to the heating resistor is provided on the other main surface. A recessed portion of the regulated sectional area and depth is formed in the other main surface of the soaking plate, and a temperature measurement element of the regulated wire diameter is inserted in the recessed portion, and adhered and fixed thereto with filler. COPYRIGHT: (C)2004,JPO&NCIPI
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