发明名称 |
Method for preparing an insulating resin composition, insulating resin composition, multilayer wiring board and process for producing the same |
摘要 |
Directed to an insulating resin composition which comprises (A) a novolak epoxy resin having a biphenyl structure, (B) carboxylic acid-modified acrylonitrile butadiene rubber particles, (C) a triazine ring-containing cresol novolak phenolic resin, (D) a phenolic hydroxyl group-containing phosphorus compound, and (E) inorganic filler, an insulating film having a support using the same, a multilayer wiring board, and a process for producing a multilayer wiring board.
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申请公布号 |
US2004161612(A1) |
申请公布日期 |
2004.08.19 |
申请号 |
US20040773220 |
申请日期 |
2004.02.09 |
申请人 |
HITACHI CHEMICAL CO., LTD. |
发明人 |
TAKANEZAWA SHIN;MORITA KOJI;WATANABE TAKAKO;KUMAKURA TOSHIHISA;FUKAI HIROYUKI;FUJITA HIROAKI |
分类号 |
B32B27/38;C08G59/62;C08K5/53;C08L63/04;H05K1/00;H05K3/46;(IPC1-7):B32B27/38 |
主分类号 |
B32B27/38 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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