| 发明名称 |
Semiconductor device and method for designing the same |
| 摘要 |
In a semiconductor device having an uppermost layer wiring beneath a bump to be connected to a rewiring layer wiring, the uppermost layer wiring is formed so that the surface of a protection film covered with the uppermost layer wiring has no unevenness beneath the bump.
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| 申请公布号 |
US2004159943(A1) |
申请公布日期 |
2004.08.19 |
| 申请号 |
US20040761310 |
申请日期 |
2004.01.22 |
| 申请人 |
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. |
发明人 |
ISEDA YASUNAGA;KANAZAWA HIDEKI |
| 分类号 |
H01L23/52;H01L21/3205;H01L21/60;H01L21/82;H01L21/822;H01L23/485;H01L27/04;(IPC1-7):H01L23/48 |
主分类号 |
H01L23/52 |
| 代理机构 |
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代理人 |
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| 主权项 |
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