发明名称 |
Soft solder alloy, for soldering aluminum materials, is based on tin with light metals in a solid intermetallic phase during soldering and forming a further metal oxide during or after soldering |
摘要 |
<p>The soft solder alloy wire is based on tin. The alloy contains at least one light metal in a generally eutectic composition with particles at least in a solid intermetallic phase during soldering. At least one further light metal is included with a thermo chemical potential, so that a further metal oxide is formed by oxidizing during or after soldering. The first and/or second light metal is lithium, sodium, magnesium and/or aluminum.</p> |
申请公布号 |
DE10304469(A1) |
申请公布日期 |
2004.08.19 |
申请号 |
DE2003104469 |
申请日期 |
2003.02.04 |
申请人 |
FNE FORSCHUNGSINSTITUT FUER NICHTEISEN-METALLE FREIBERG GMBH |
发明人 |
WAGNER, JOACHIM;PAETZOLD, VOLKER;BEREK, HARRY |
分类号 |
B23K35/02;B23K35/26;(IPC1-7):B23K35/26 |
主分类号 |
B23K35/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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