| 摘要 |
PROBLEM TO BE SOLVED: To reduce a processing defect on the surface of a substrate except for an end face of the substrate. SOLUTION: An unprocessed wafer W is placed on support faces 122A of three support members 12. Sandwiching members 13 rotate around a shaft 131 taken as the center. The wafer W is sandwiched with the sandwiching members 13. In the process, lower inclination faces 136B of sandwiching parts 133 abut on a lower face side end edge at an end face of the wafer W. When the sandwiching members 13 rotate furthermore, the lower face-side end edge at the end face of the wafer W slides up the lower inclination face 136B. An upper face-side end edge at the end face of the wafer W abuts on an upper inclination face 136A of the sandwiching part 133, and the end face of the wafer W becomes a state where it is sandwiched with the upper inclination face 136A and the lower inclination face 136B. Thus, the wafer W placed on the support member 12 is sandwiched with the three sandwiching members 13 and is lifted up. It is almost horizontally held in a position higher than the support position of the wafer W by the support members 12. COPYRIGHT: (C)2004,JPO&NCIPI |
