| 摘要 |
PROBLEM TO BE SOLVED: To provide a package for housing a semiconductor element which is capable of easily and accurately housing the semiconductor element and easily and accurately mounted on a board or the like, capable of keeping the semiconductor element high in heat dissipating properties, and keeps high mounting reliability. SOLUTION: The ball grid array semiconductor element housing package 10 is equipped with a semiconductor element mount 14 where the semiconductor element 13 is mounted and which is formed of a cutout space 12 provided at the center of one or more insulating bases 11, and external connection terminal pads 16 which are provided to the lowermost surface of the insulating base 11 and where external connection terminals 15 are bonded. A heat transfer board 17 is provided to the semiconductor element mount 14 and bonded to the insulating base 11 so as to stop up one open side of the cutout space 12 for dissipating downward heat released from the semiconductor element 13, and one more heat diffusion layers 18 which dissipate heat released from the semiconductor element 13 diffusing it in a lateral direction are provided to the insulating bases 11. COPYRIGHT: (C)2004,JPO&NCIPI |
