| 发明名称 |
Copper-containing C4 ball-limiting metallurgy stack for enhanced reliability of packaged structures and method of making same |
| 摘要 |
The invention relates to a ball-limiting metallurgy stack for an electrical device that contains at least one copper layer disposed upon a Ti adhesion metal layer. The ball-limiting metallurgy stack resists Sn migration toward the upper metallization of the device.
|
| 申请公布号 |
US2004159944(A1) |
申请公布日期 |
2004.08.19 |
| 申请号 |
US20040776076 |
申请日期 |
2004.02.10 |
| 申请人 |
DATTA MADHAV;EMORY DAVE;JOSHI SUBHASH M.;MENEZES SUSANNE;SUH DOOWON |
发明人 |
DATTA MADHAV;EMORY DAVE;JOSHI SUBHASH M.;MENEZES SUSANNE;SUH DOOWON |
| 分类号 |
H01L21/60;H01L23/485;(IPC1-7):H01L21/44;H01L23/48;H01L29/40 |
主分类号 |
H01L21/60 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
