发明名称 A LEAD-FREE SOLDER, AND A LEAD-FREE JOINT
摘要 A solder not containing lead (a lead-free solder) contains zinc and tin, and also contains 5 weight percent or less nickel and 0.5 weight percent or less aluminum with a liquid phase temperature of 260 degrees C or greater. In addition, a lead-free solder has a liquid phase temperature of 260 degrees C or greater, and contains 30 to 70 weight percent zinc, 5 weight percent or less nickel, and the remaining weight percent tin. Moreover, a joint is manufactured using these lead-free solders. As a result, a lead-free solder and a lead-free joint having excellent electrical characteristics but not including harmful substances, can be provided.
申请公布号 WO2004038053(A3) 申请公布日期 2004.08.19
申请号 WO2003JP13511 申请日期 2003.10.23
申请人 KOA KABUSHIKI KAISHA;SOLDERCOAT CO., LTD.;OKABE GIKEN CO., LTD.;KOBAYASHI, SATORU;KATO, KAZUYUKI;SUGIURA, MASAHIRO;OKABE, SABURO 发明人 KOBAYASHI, SATORU;KATO, KAZUYUKI;SUGIURA, MASAHIRO;OKABE, SABURO
分类号 B23K35/26;B23K35/28;C22C13/00;C22C18/00;C23C2/06;H05K3/34 主分类号 B23K35/26
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