| 摘要 |
Laminates which are improved in heat resistance and little cause defects such as blister in the reflow step can be produced by piling up a prescribed number of prepregs obtained by subjecting a substrate impregnated with a solution containing an alkoxysilane derivative and/or a condensate thereof to impregnation with a thermosetting resin free from a halogen -containing flame retardant and heat-drying the obtained resin-impregnated substrate, putting copper foil on one or both of the surfaces of the obtained pile of prepregs at need, and hot-pressing the resulting pile to form a laminate. |
