发明名称 METHOD FOR MEASURING THICKNESS OF THIN FILM
摘要 PURPOSE: A method for measuring thickness of a thin film is provided to set up a reference value and measure the thickness by using an X-ray reflectometry and an X-ray fluorescence spectroscopy. CONSTITUTION: X-rays are irradiated on a surface of a reference wafer including a reference thin film(S100). The thickness of the reference thin film is measured by using the X-rays reflected from the reference wafer(S200). A reference value is set up by using the measured thickness of the reference thin film(S300). The X-rays are irradiated on the surface of a target wafer including a thin film as a measuring target(S400). The intensity of fluorescent X-rays generated from the target wafer is measured(S500). The thickness of the target thin film is measured by comparing the measured intensity with the reference value(S600).
申请公布号 KR20040072780(A) 申请公布日期 2004.08.19
申请号 KR20030008408 申请日期 2003.02.11
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 KO, YEONG MIN;PARK, PYEONG SEON
分类号 H01L21/66;(IPC1-7):H01L21/66 主分类号 H01L21/66
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