| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a DC transmitter/receiver made into a single chip for reducing the DC offset, and its manufacturing method. <P>SOLUTION: The DC transmitter/receiver includes a substrate provided with a mixer part and a local oscillator as a circuit, a positive hole for shielding the effects of signal leakage radiated at the mixer part and the local oscillator, a shielding ground plane which is provided above the substrate and which shields the signal leakage caused in a process of inputting a signal from an antenna to the mixer part and the signal leakage caused in a process of inputting a reference signal from the local oscillator to the mixer part, a first wiring which is provided above the shielding ground plane and connects the mixer part and the local oscillator, and a dielectric layer which is laminated so as to cover the first wiring between the substrate and the shielding ground plane, and above the shielding ground plane. It is made into a single chip. <P>COPYRIGHT: (C)2004,JPO&NCIPI |
