| 发明名称 |
NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION CONTAINING EPOXY-CONTAINING SUBSTANCE |
| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a negative photosensitive resin composition containing an epoxy-containing substance. <P>SOLUTION: The negative photosensitive resin composition contains an epoxy-containing substance and polyparavinylphenol. The negative photosensitive resin composition has favorable developing property with an aqueous solution of tetramethylammonium hydroxide. <P>COPYRIGHT: (C)2004,JPO&NCIPI |
| 申请公布号 |
JP2004233693(A) |
申请公布日期 |
2004.08.19 |
| 申请号 |
JP20030022666 |
申请日期 |
2003.01.30 |
| 申请人 |
ROHM & HAAS ELECTRONIC MATERIALS LLC |
发明人 |
ARAO KEI;NOMURA MAKOTO |
| 分类号 |
G03F7/032;G03F7/004;G03F7/027;G03F7/038 |
主分类号 |
G03F7/032 |
| 代理机构 |
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