发明名称 |
MOLD CLEANING METHOD AND DEVICE |
摘要 |
PROBLEM TO BE SOLVED: To efficiently remove a residue adhering to a mold without damaging the mold. SOLUTION: The mold 13 with the residue 14 adhering thereon is prepared. By making pulse laser beam, which has a property to penetrate the residue and reflect at an interface between the residue and the mold and consequently separate the residue at the reflected position from the mold, incident from the surface of the residue onto the mold, some part of the residue at the incident position is separated from the mold. COPYRIGHT: (C)2004,JPO&NCIPI |
申请公布号 |
JP2004230750(A) |
申请公布日期 |
2004.08.19 |
申请号 |
JP20030022970 |
申请日期 |
2003.01.31 |
申请人 |
SUMITOMO HEAVY IND LTD;SAINEKKUSU:KK |
发明人 |
WAKABAYASHI NAOKI;UEHARA JUNICHI |
分类号 |
B29C33/72;B29K63/00;B29K83/00;(IPC1-7):B29C33/72 |
主分类号 |
B29C33/72 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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