发明名称 MOLD CLEANING METHOD AND DEVICE
摘要 PROBLEM TO BE SOLVED: To efficiently remove a residue adhering to a mold without damaging the mold. SOLUTION: The mold 13 with the residue 14 adhering thereon is prepared. By making pulse laser beam, which has a property to penetrate the residue and reflect at an interface between the residue and the mold and consequently separate the residue at the reflected position from the mold, incident from the surface of the residue onto the mold, some part of the residue at the incident position is separated from the mold. COPYRIGHT: (C)2004,JPO&NCIPI
申请公布号 JP2004230750(A) 申请公布日期 2004.08.19
申请号 JP20030022970 申请日期 2003.01.31
申请人 SUMITOMO HEAVY IND LTD;SAINEKKUSU:KK 发明人 WAKABAYASHI NAOKI;UEHARA JUNICHI
分类号 B29C33/72;B29K63/00;B29K83/00;(IPC1-7):B29C33/72 主分类号 B29C33/72
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