| 摘要 |
PROBLEM TO BE SOLVED: To provide a packaging buffer material, which enables the reduction of constituents to be used and has deformability and shape restorableness in some degree, and a packaging material for a heating cooking utensil, using the packaging buffer material. SOLUTION: The packaging material has a structure such that a packaging buffer material body 21 formed by processing a paper material has an inner space, which is filled with one or a plurality of gas-sealed buffer materials 23 made of a resin film F in which a gas 22 is sealed in. One packaging material has a plurality of spaces, a given one or all of which are filled with the gas-sealed buffer materials. A resin film having a multilayer structure may be used to make the gas-sealed buffer material. COPYRIGHT: (C)2004,JPO&NCIPI
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