发明名称 |
Chemical mechanical polishing atomizing rinse system |
摘要 |
A substrate polishing system includes a delivery arm having a nozzle configured to combine a rinse fluid and a gas into an atomized spray, and to direct the atomized spray toward a polishing pad. The atomization process causes droplets of the rinse agent in the atomized spray to become negatively charged. The negative charge causes in the rinse agent to adhere to waste particles and slurry, which facilitates removal thereof from the polishing pad.
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申请公布号 |
US2004162007(A1) |
申请公布日期 |
2004.08.19 |
申请号 |
US20030368738 |
申请日期 |
2003.02.19 |
申请人 |
PHAN KY;PHAM XUYEN;BETTENCOURT GREG;ZHOU REN |
发明人 |
PHAN KY;PHAM XUYEN;BETTENCOURT GREG;ZHOU REN |
分类号 |
B24B37/04;B24B53/007;H01L21/00;(IPC1-7):B24B1/00 |
主分类号 |
B24B37/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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