发明名称 METHOD FOR FABRICATING LEAD FRAME
摘要 PURPOSE: A method for fabricating a lead frame is provided to reduce the manufacturing cost and the manufacturing period by performing a pattern print process using a low-priced stamp and a lead frame process using an etch method. CONSTITUTION: A stamp fabrication process is performed to a stamp having the same shape as a required pattern of a lead frame. In the stamp fabrication process, the desired pattern is printed on a lead frame material by using the fabricated stamp. The lead frame material is processed by using an etch method. A lead frame is formed by processing the lead frame material. The stamp is formed with silicon rubber.
申请公布号 KR20040072850(A) 申请公布日期 2004.08.19
申请号 KR20030008500 申请日期 2003.02.11
申请人 LG ELECTRONICS INC. 发明人 HONG, SUN GUK;JANG, GYEONG HWAN;KIM, HYEONG RAE;LEE, CHANG YUN;LEE, GANG UK;LEE, SANG SU
分类号 H01L21/50;H01L23/50;(IPC1-7):H01L21/50 主分类号 H01L21/50
代理机构 代理人
主权项
地址