发明名称 |
METHOD FOR FABRICATING LEAD FRAME |
摘要 |
PURPOSE: A method for fabricating a lead frame is provided to reduce the manufacturing cost and the manufacturing period by performing a pattern print process using a low-priced stamp and a lead frame process using an etch method. CONSTITUTION: A stamp fabrication process is performed to a stamp having the same shape as a required pattern of a lead frame. In the stamp fabrication process, the desired pattern is printed on a lead frame material by using the fabricated stamp. The lead frame material is processed by using an etch method. A lead frame is formed by processing the lead frame material. The stamp is formed with silicon rubber.
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申请公布号 |
KR20040072850(A) |
申请公布日期 |
2004.08.19 |
申请号 |
KR20030008500 |
申请日期 |
2003.02.11 |
申请人 |
LG ELECTRONICS INC. |
发明人 |
HONG, SUN GUK;JANG, GYEONG HWAN;KIM, HYEONG RAE;LEE, CHANG YUN;LEE, GANG UK;LEE, SANG SU |
分类号 |
H01L21/50;H01L23/50;(IPC1-7):H01L21/50 |
主分类号 |
H01L21/50 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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