发明名称 |
MANUFACTURING PROCESS OF INTEGRATED CIRCUITS IN FLIP-CHIP TECHNOLOGY |
摘要 |
A process for manufacturing integrated circuits in flip-chip technology having contact elements (31) realised on predetermined contact areas (23), comprises the steps of readying electrical connections (30) in such a way as mutually to connect all the contact areas (23) of said integrated circuit (21), galvanically depositing a contact element (31) in correspondence with each of said contact areas (23) and interrupting said electrical connections (30) between the contact areas (23). |
申请公布号 |
EP1446830(A2) |
申请公布日期 |
2004.08.18 |
申请号 |
EP20020745789 |
申请日期 |
2002.06.13 |
申请人 |
SILENA INTERNATIONAL S.P.A. |
发明人 |
LO VERDE, DOMENICO;SANCES, GIUSEPPE |
分类号 |
H01L21/288;H01L21/60;H01L21/768 |
主分类号 |
H01L21/288 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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