Semisolid thermal interface with low flow resistance

摘要

An interface material for use in forming a coating interposed along a heat dissipating path between a solid state electronic device and a heat sinking surface. The coating consists of a formulation of a thermally stable wax which is formed as a polyorganosiloxane graft polymer of octadecene and a methylsiloxane host blended with a thermally conductive viscosity stabilizer consisting of a thermally conductive particulate material such as alumina, boron nitride, among others. The graft polymer, with its molecular weight of between approximately 10,000 and 15,000 has a density of between about 0.8 and 0.9 with a melting point of between about 30 degrees C. and 90 degrees C.