| 摘要 |
To provide a high-frequency device capable of reliably attaching metal tape without causing damage to the metal tape, and thus obtaining an excellent shielding effect. In a high-frequency device according to the present invention, the metal tape 9 comprises first and second separated adhesion portions 9b, 9c which are separable from each other by a cut portion 9a, a connected adhesion portion 9d for interconnecting the first and second separated adhesion portions 9b, 9c, and a hole 9e provided in the front end of the cut portion 9a; the first and second separated adhesion portions 9b, 9c are formed to be capable of being bent perpendicularly to the connected adhesion portion 9d; the first and second separated adhesion portions 9b, 9c of the metal tape 9 are attached to adjacent sidewalls 5a of the shield cover 5, respectively; and the connected adhesion portion 9d is attached on the circuit board 2 or on the upper surface of the shield frame 10 disposed in the case 1 in the proximity of the shield cover 5. Therefore, tensile force is not applied to the front end of the cut portion 9a, that is, it gets out of the hole 9e, therefore, the front end of the cut portion 9a will not get damaged.
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