SEMICONDUCTOR DECAPPING APPARATUS AND DECAPPING METHOD USING THE SAME

摘要

PURPOSE: A semiconductor decapping apparatus and a decapping method using the same are provided to enhance the productivity of semiconductors by decapping only a desired die. CONSTITUTION: A wafer is loaded on a wafer fixing plate. An anti-pollution layer(40) is used for surrounding a decapping die. A supporter(10) is used for supporting the wafer fixing plate. An air gun(70) is installed at a lower side of the wafer fixing plate and an upper part of the supporter. A grinder supporter is installed at an upper part of one side of the supporter and is spread to an upper part of the wafer loaded on the wafer fixing plate. A grinder(50) is adhered to an upper part of one side of the grinder supporter and is located within the anti-pollution layer. A nozzle(60) is close to one side of the grinder and is located within the anti-pollution layer.