发明名称 Puncture resistant, high shrink films, blends, and process
摘要 A polymer blend and mono-and multilayer films made therefrom having an improved combination of properties such as high shrinkage values and high puncture resistance wherein the blend has a first copolymer of ethylene and octene-1 having a copolymer melting point of from 55 to 95° C., preferably of from 80 to 92° C.; a second copolymer of ethylene and at least a alpha-olefin having a copolymer melting point of from 115 to 128° C.; and a third copolymer of ethylene and a vinyl ester or alkyl acrylate and having a melting point of from 60 to 110° C., and a process for making such films, which preferably have at least 45% shrinkage at 90° C. in at least one direction.
申请公布号 US6777046(B1) 申请公布日期 2004.08.17
申请号 US19990431931 申请日期 1999.11.01
申请人 CURWOOD, INC. 发明人 TATARKA PAUL DAVID;GEORGELOS PAUL NICK;IDLAS SCOTT ALLAN
分类号 B29C55/02;B29C55/28;B32B27/08;B32B27/32;B65D75/00;B65D77/04;C08J5/18;C08L23/08;(IPC1-7):B32B27/00;C08L33/00 主分类号 B29C55/02
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