发明名称 |
Puncture resistant, high shrink films, blends, and process |
摘要 |
A polymer blend and mono-and multilayer films made therefrom having an improved combination of properties such as high shrinkage values and high puncture resistance wherein the blend has a first copolymer of ethylene and octene-1 having a copolymer melting point of from 55 to 95° C., preferably of from 80 to 92° C.; a second copolymer of ethylene and at least a alpha-olefin having a copolymer melting point of from 115 to 128° C.; and a third copolymer of ethylene and a vinyl ester or alkyl acrylate and having a melting point of from 60 to 110° C., and a process for making such films, which preferably have at least 45% shrinkage at 90° C. in at least one direction.
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申请公布号 |
US6777046(B1) |
申请公布日期 |
2004.08.17 |
申请号 |
US19990431931 |
申请日期 |
1999.11.01 |
申请人 |
CURWOOD, INC. |
发明人 |
TATARKA PAUL DAVID;GEORGELOS PAUL NICK;IDLAS SCOTT ALLAN |
分类号 |
B29C55/02;B29C55/28;B32B27/08;B32B27/32;B65D75/00;B65D77/04;C08J5/18;C08L23/08;(IPC1-7):B32B27/00;C08L33/00 |
主分类号 |
B29C55/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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