发明名称 |
Semiconductor device including stacked dies mounted on a leadframe |
摘要 |
A semiconductor device including a leadframe and two stacked dies, a first of which is on a top surface of a leadframe while the second one is on a bottom surface of the leadframe. The drain region of the first die is coupled to a drain clip assembly that includes a drain clip that is in contact with a lead rail. The body of the semiconductor device includes a window or opening that exposes the drain region of the second die. |
申请公布号 |
US6777786(B2) |
申请公布日期 |
2004.08.17 |
申请号 |
US20010805597 |
申请日期 |
2001.03.12 |
申请人 |
FAIRCHILD SEMICONDUCTOR CORPORATION |
发明人 |
ESTACIO MARIA CRISTINA B. |
分类号 |
H01L23/495;(IPC1-7):H01L23/495 |
主分类号 |
H01L23/495 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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