发明名称 |
Process of removing holefill residue from a metallic surface of an electronic substrate |
摘要 |
A process of removing excess holefill material from a surface of an electronic substrate in which the holefill residue is contacted with a swelling agent followed by planarizing of the surface in the presence of an agent no stronger than a liquid having a pH of about 6 to about 8.
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申请公布号 |
US6776852(B2) |
申请公布日期 |
2004.08.17 |
申请号 |
US20020046621 |
申请日期 |
2002.01.14 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
BOYKO CHRISTINA M.;CURCIO BRIAN E.;FARQUHAR DONALD S.;WOZNIAK MICHAEL |
分类号 |
H05K3/00;(IPC1-7):B08B3/00 |
主分类号 |
H05K3/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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