发明名称 |
Electrolytic copper foil with carrier foil and method for manufacturing the same and copper-clad laminate using the electrolytic copper foil with carrier foil |
摘要 |
To control peel strength at an organic release interface between a carrier foil and a copper-microparticle layer which constitute an electrodeposited copper foil with carrier. In the present invention, (1) a barrier copper layer is formed on the release interface layer and copper microparticles are formed on the barrier layer; (2) the anti-corrosion treatment is carried out by use of a plating bath containing a single metallic component or a plurality of metallic components for forming an alloy, the plating bath(s) having a deposition potential less negative than -900 mV (vs. AgCl/Ag reference electrode); and (3) methods (1) and (2) are combined.
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申请公布号 |
US6777108(B1) |
申请公布日期 |
2004.08.17 |
申请号 |
US20010856350 |
申请日期 |
2001.05.18 |
申请人 |
MITSUI MINING & SMELTING CO., LTD. |
发明人 |
OBATA SHIN-ICHI;DOBASHI MAKOTO |
分类号 |
H05K3/00;B32B15/08;C25D1/04;C25D1/22;H05K3/02;(IPC1-7):B32B15/04;B32B15/20;C25D5/00;C25D5/34 |
主分类号 |
H05K3/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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