发明名称 |
Semiconductor plating system workpiece support having workpiece engaging electrode with pre-conditioned contact face |
摘要 |
A semiconductor workpiece holder used in electroplating systems for plating metal layers onto a semiconductor workpieces, and is of particular advantage in connection with plating copper onto semiconductor materials. The workpiece holder includes electrodes which have a contact face which bears against the workpiece and conducts current therebetween. The contact face is provided with a contact face outer contacting surface which is made from a contact face material similar similar to the workpiece plating material which is to be plated onto the semiconductor workpiece. The contact face can be formed by pre-conditioned an electrode contact using a plating metal which is similar to the plating materials which is to be plated onto the semiconductor workpiece.
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申请公布号 |
US6776892(B1) |
申请公布日期 |
2004.08.17 |
申请号 |
US20000525930 |
申请日期 |
2000.03.14 |
申请人 |
SEMITOOL, INC. |
发明人 |
RITZDORF THOMAS L.;TURNER JEFFREY I. |
分类号 |
H01L21/687;(IPC1-7):C25D5/02;C25D7/00;C25D11/32 |
主分类号 |
H01L21/687 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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