| 摘要 |
Heat dissipater for integrated circuits comprising a dispersion element able to be associated to an integrated circuit, through securing means constituted by two locking elements mounted on the dispersion element in mutually opposite positions. The locking elements have each a latching pin and are able to slide laterally to the dispersion element from a lower position in which the pins are inferiorly distanced from the base and form between them a passage for the coupling of the dissipater on an integrated circuit, to an upper position in which the pins are proximate to the base and are mutually approached. The dissipater further comprises elastic means interposed between the dispersion element and the locking elements to thrust them towards the upper position.
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