| 摘要 |
The cleaning device may clean probe elements. The probe elements may be the probe elements of a probe card testing apparatus for testing semiconductor wafers or semiconductor dies on a semiconductor wafer or the probe elements of a handling/testing apparatus for testing the leads of a packaged integrated circuit. During the cleaning of the probe elements, the probe card or the handler/tester is cleaned during the normal operation of the testing machine without removing the probe card from the prober. The cleaning device may be placed within the prober or tester/handler similar to a wafer containing semiconductor dies to be tested so that the probe elements of the testing machine contact the cleaning medium periodically to remove debris and/or reshape the tips of the probe elements. The cleaning device may include a substrate, that may be shaped and sized like a typical semiconductor wafer that typically fits into the testing machine, and a pad attached to the upper surface of the substrate that cleans and/or reshapes the probe element tips without removing the testing head with the probe elements from the testing machine. The cleaning medium may chemically clean the probe elements and trap the environmentally hazardous material within and on the pad.
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