| 摘要 |
A configuration of conductive bumps on a flip chip and a redistribution layer is disclosed. The configuration comprise: a plurality of power bumps and ground bumps disposed in hive-shaped arrangement on the core of a flip chip; a plurality of power lines slanted by 60-degree angle, relative to a horizontal line, for connecting power bumps; and a plurality of ground lines slanted by 60-degree angle, relative to a horizontal line, for connecting ground bumps. The conductive bumps of the second embodiment are disposed in a checkerboard arrangement. The conductive bumps of the third embodiment are disposed in a staggered arrangement, and the power bumps and the ground bumps are respectively connected by power lines and ground lines, which are slanted in 45-degree angle, relative to a horizontal line. The power lines and the ground lines are in the redistribution layer. |
