SOLDER ALLOY FOR SEMICONDUCTOR PACKAGING AND METHOD FOR MANUFACTURING THE SAME, AND SOLDER BALL AND ELECTRONIC MEMBER

摘要

PROBLEM TO BE SOLVED: To provide a solder alloy for semiconductor packaging which prevents breakdown of a solder junction by thermal stress and simultaneously ensures sufficient joining strength by suppressing generation of a void and to provide a method for manufacturing the same, a solder ball and an electronic member. SOLUTION: The solder alloy for semiconductor packaging is mainly composed of Sn, contains 55 to 70mass% Sn and 0.5 to 5.0mass% Ag, and the balance consisting of Pb and inevitable impurities. The oxygen concentration in the solder alloy is 0.5 to 12 ppm. COPYRIGHT: (C)2004,JPO&NCIPI