| 摘要 |
PROBLEM TO BE SOLVED: To provide a mounting structure of a ball-grid-array IC which can mount the ball-grid-array IC in parallel to a substrate without inclination, can prevent the occurrence of defective soldering, can prevent the ball-grid-array IC from being twisted to the substrate when it is mounted, and can prevent its terminals from being short-circuited. SOLUTION: The mounting structure of the ball-grid-array IC 1 includes resin guide ribs 4 arranged at both sides of a main body 2 of the ball-grid-array IC 1, locking claws 4a which are formed at the lower ends of the guide ribs 4 and fitted in the insertion holes 5a of the substrate 5, springs 6 fitted in the guide ribs 4, and height-adjusting ribs 7 which are arranged inside the guide ribs 4 in a protruding state with a small interval. When the ball-grid-array IC 1 is mounted on the substrate 5, strong pressing force can be prevented by the springs 6, and the ball-grid-array IC 1 can be adjusted to have a prescribed height to the substrate 5 by the height-adjusting ribs 7. COPYRIGHT: (C)2004,JPO&NCIPI
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